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Ultrasound MIMO Relay with Wireless Power and Communication for Neural Interfaces

Designer: Ernest So
Tapeout details: TSMC 180nm HV BCD; April 2022.
Publications: ISSCC 2024

W-Band Spillover-Tolerant Mixer-First Receiver for FMCW Radars

Designer: Jingzhi Zhang
Tapeout details: TSMC 40nm CMOS
Publications: RFIC 2023

Motion Deconvolution Kernel Generator for mmWave Radar

Designers: Nikhil Poole.
Tapeout details: Google SkyWater 130-nm CMOS; August, 2021.
Publication: IEEE Access

Multi-Frequency Ultrasonic Receiver

Designers: Ajay Singhvi
Tapeout details: TSMC 180nm HV BCD; April 2021
Publication: ISSCC

Implantable Potentiostat

Designers: Max Wang
Tapeout details: TSMC 180nm HV BCD; December 2020
Publication: BioCAS

RF-Ultrasound Relay

Designers: Ernest So, Pyungwoo Yeon
Tapeout details: TSMC 180nm HV; May 2020
Publications: VLSI, JSSC

High Power PA for Handheld Thermoacoustic Imaging

Designers: Christopher Sutardja
Tapeout details: ST 55 nm BiCMOS; September 2019
Publications: RFIC, JSSC

Electrochemical Sensor

Designers: Jun-Chau Chien
Tapeout details: TSMC 65nm CMOS
Publication: VLSI, ISSCC, JSSC

Wireless Microscope

Designers: Ahmed Sawaby, Max Wang, Ernest So, Jun-Chau Chien
Tapeout details: TSMC 65nm CMOS; August 2017
Publication: VLSI

Programmable RF Transmitter

Designer: Hao Nan
Tapeout details: ST 55nm BiCMOS
Publication: IMS

Ultra-Low-Power Ultrasonic Wake-Up Receiver

Designer: Angad Rekhi
Tapeout details: TSMC 65nm CMOS; June 2017
Publication: ISSCC, JSSC

Implantable Pressure Sensor

Designers: Marcus Weber, Jayant Charthad, Yoshiaki Yoshihara, Ahmed Sawaby
Tapeout details: TSMC 180nm HV BCD; September 2016
Publications: VLSI, JSSC

Implantable Electrical Stimulator

Designers: Jayant Charthad, Ahmed Sawaby
Tapeout details: TSMC 180nm HV BCD; June 2016
Publication: TBIOCAS

Wireless Temperature Sensor

Designer: Siavash Kananian
Tapeout details: ST 28nm FDSOI

Designers: Mahmoud Sawaby, Afshin Babveyh
Tapeout details: ST 55nm BiCMOS

Implantable Chip for Duplex Ultrasonic Power and Data

Designers: Jerry Chang, Jayant Charthad
Tapeout details: TSMC 65nm CMOS; February 2016
Publication: ISSCC

A 10 Mb/s 915 MHz BFSK Transmitter for Wireless Capsule Endoscopy

Designer: Spiros Baltsavias
Tapeout details: TSMC 65nm CMOS; February 2016
Publication: IUS

Designers: Mahmoud Sawaby, Cheng Chen, Baptiste Grave
Tapeout details: ST 55nm BiCMOS

mm-Wave OOK Transceiver

Designers: Baptiste Grave, Afshin Babveyh, Cheng Chen, Mahmoud Sawaby
Tapeout details: ST 55nm BiCMOS; November 2014
Publication: ISSCC

Designers: Nick Saiz, Baptiste Grave
Tapeout details: ST 55nm BiCMOS

D-Band Transmitter for High EIRP/Channel Arrays

Designer: Nick Saiz
Tapeout details: ST 0.13μm BiCMOS ; May 2014
Publication: CICC

Wirelessly Powered Implant Chip for Hybrid Bi-Directional Data Communications

Designers: Jayant Charthad, Marcus Weber, Mahmoud Saadat
Tapeout details: TSMC 65nm CMOS; November 2013
Publication: CICC, JSSC