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Designers: Ahmed Sawaby, Max Wang, Ernest So,
Jun-Chau Chien
Tapeout details: TSMC 65nm CMOS; August 2017


Designers: Ajay Singhvi, Kevin Boyle
Tapeout details: TSMC 65nm CMOS

Ultra-Low-Power Ultrasonic Wake-Up Receiver

Designer: Angad Rekhi
Tapeout details: TSMC 65nm CMOS; June 2017
Publication: ISSCC

Designer: Hao Nan
Tapeout details: ST 55nm BiCMOS

Implantable Pressure Sensor

Designers: Marcus Weber, Jayant Charthad, Yoshiaki Yoshihara, Ahmed Sawaby
Tapeout details: TSMC 180nm HV BCD; September 2016
Publications: VLSI, JSSC
Implantable Electrical Stimulator

Designers: Jayant Charthad, Ahmed Sawaby
Tapeout details: TSMC 180nm HV BCD; June 2016
Publication: TBIOCAS

Designer: Siavash Kananian
Tapeout details: ST 28nm FDSOI


Designers: Mahmoud Sawaby, Afshin Babveyh
Tapeout details: ST 55nm BiCMOS

Implantable Chip for Duplex Ultrasonic Power and Data

Designers: Jerry Chang, Jayant Charthad
Tapeout details: TSMC 65nm CMOS; February 2016
Publication: ISSCC
A 10 Mb/s 915 MHz BFSK Transmitter for Wireless Capsule Endoscopy

Designer: Spiros Baltsavias
Tapeout details: TSMC 65nm CMOS; February 2016
Publication: IUS

Designers: Mahmoud Sawaby, Cheng Chen, Baptiste Grave
Tapeout details: ST 55nm BiCMOS


Designers: Mahmoud Sawaby, Cheng Chen, Baptiste Grave
Tapeout details: ST 55nm BiCMOS


Designer: Mahmoud Sawaby
Tapeout details: ST 55nm BiCMOS

mm-Wave OOK Transceiver

Designers: Baptiste Grave, Afshin Babveyh, Cheng Chen, Mahmoud Sawaby
Tapeout details: ST 55nm BiCMOS; November 2014
Publication: ISSCC

Designers: Nick Saiz, Baptiste Grave
Tapeout details: ST 55nm BiCMOS

D-Band Transmitter for High EIRP/Channel Arrays

Designer: Nick Saiz
Tapeout details: ST 0.13μm BiCMOS ; May 2014
Publication: CICC
Wirelessly Powered Implant Chip for Hybrid Bi-Directional Data Communications

Designers: Jayant Charthad, Marcus Weber, Mahmoud Saadat
Tapeout details: TSMC 65nm CMOS; November 2013
Publication: CICC, JSSC

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